High-performance thermal paste specially designed for overclocking or gaming PCs. 3G thermal paste that is easy to apply and perfectly fills the space between your cooler and CPU.
Nanotechnology improves heat conduction via its micro molecules. Made with non-electric conductive materials, this thermal paste is completely safe to use. Includes a spreader for quick and easy application.
Key Features
GameMax - GameMax is launching TG3, thermal paste delivering a high performance thermal bonding agent for your processing capabilities - CPU, GPU/VGA, Heat Sink & Chipset.
Highly Efficient - TG3 is a high performance thermal paste. It enhances the efficiency of the heat conduction for the CPU and GPU so you can game for hours without worrying about overheating your CPU.
TG3 Thermal Paste - Using nanotechnology the TG3 thermal paste is highly efficient and highly durable for long-lasting use.
W/m.k= 5.15 - Non-electric conductive materials ensure safe usage. The thermal paste is completely safe and the nanotechnology in the paste improves heat conduction via it's micro molecules.
Easy Application - 3 grams of thermal paste and spreader this well balanced formula allows for easy application and clean up.
Nano Technology - Temperature from -50 to 240 Degrees Celsius - low evaporation point and high temperature tolerance, nanotechnology improves heat conduction.
Specifications
Model: TG3 (3G)
Thermal Conductivity: >5.15W/m-K
Thermal Impedance: <0.205 ℃ - in 2/W
Specific Gravity: >3.25
Viscosity: 1000 cps
Thixotropic Index: 330 ±10mm
Moment Beared Temperature: -50~240℃
Operation Temperature: -30~220℃
Silicone Compounds: 30%
Carbon Compounds: 20%
Metal Oxide Compounds: 50%
